JPS6144847U - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6144847U JPS6144847U JP1984128347U JP12834784U JPS6144847U JP S6144847 U JPS6144847 U JP S6144847U JP 1984128347 U JP1984128347 U JP 1984128347U JP 12834784 U JP12834784 U JP 12834784U JP S6144847 U JPS6144847 U JP S6144847U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- heat sink
- screw hole
- cut surface
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128347U JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984128347U JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144847U true JPS6144847U (ja) | 1986-03-25 |
| JPH0423329Y2 JPH0423329Y2 (en]) | 1992-05-29 |
Family
ID=30686978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984128347U Granted JPS6144847U (ja) | 1984-08-24 | 1984-08-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144847U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11732807B2 (en) | 2019-11-15 | 2023-08-22 | Kitz Corporation | Eccentric butterfly valve |
-
1984
- 1984-08-24 JP JP1984128347U patent/JPS6144847U/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11732807B2 (en) | 2019-11-15 | 2023-08-22 | Kitz Corporation | Eccentric butterfly valve |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423329Y2 (en]) | 1992-05-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (ja) | 半導体装置 | |
| JPS6144847U (ja) | 半導体装置 | |
| JPS585349U (ja) | 半導体装置 | |
| JPS60939U (ja) | 半導体装置 | |
| JPS5933254U (ja) | 半導体装置 | |
| JPS5811110U (ja) | 樹脂製座付きボルト | |
| JPS6048243U (ja) | 半導体装置 | |
| JPS6046225U (ja) | プラスチック成形品の固着構造 | |
| JPS5844841U (ja) | 樹脂封止形半導体装置のモ−ルド金型 | |
| JPS6088561U (ja) | 半導体装置 | |
| JPS59192845U (ja) | 半導体装置 | |
| JPS60169843U (ja) | 絶縁型半導体装置 | |
| JPS59192846U (ja) | 半導体装置 | |
| JPS5941525U (ja) | 押出機のブレ−カプレ−ト | |
| JPS596887U (ja) | 電子機器等に於ける取付基板 | |
| JPS58140647U (ja) | リ−ドフレ−ム | |
| JPS59192850U (ja) | 半導体装置 | |
| JPS60163738U (ja) | 半導体装置 | |
| JPS6134750U (ja) | 半導体装置 | |
| JPS6130255U (ja) | リ−ドフレ−ム | |
| JPS58184848U (ja) | トランジスタ構造 | |
| JPS5989547U (ja) | 半導体装置 | |
| JPS5983214U (ja) | 回転体 | |
| JPS60190051U (ja) | 半導体装置 | |
| JPS594644U (ja) | 樹脂モ−ルド半導体装置 |